Ep. 040 - ASML Is Building a Hybrid Bonding Tool, and Its Patents Show How (AI Supply Chain) | Jordan Nanos, Howie, Sherry Zhang

ASML's patented die-to-wafer hybrid bonder flips industry convention and targets logic first, with HBM adoption unlikely before 2029.

• ASML's novel architecture: Patents reveal a die-to-wafer hybrid bonder using a SuperTrack conveyor system where dice stay fixed and the wafer, plus metrology/plasma stations, move to meet them—opposite of Besi's pick-and-place approach.
• Front-end pedigree vs back-end incumbents: Besi, ASMPT lead today's pick-and-place bonders; ASML leverages sub-nanometer lithography overlay and alignment expertise to attack finer hybrid-bond pitches.

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