Podcast EP374: How proteanTecs Tames Multi-Die Packaging Challenges with Nir Server

Multi-die chiplet packaging multiplies yield risk and cross-die interference, making real-time telemetry and pre-assembly testing commercially essential for AI chips.

• Chiplets over monolithic: Scaling AI/HPC compute now relies on breaking monolithic dies into chiplets (reducing per-die cost) and mounting HBM closer to compute to beat the memory wall.
• Known good die is critical: In multi-die packages, aggregated yield multiplies each die's yield together, so one defective chiplet scraps an entire package—including expensive HBM and substrate already assembled.

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