Podcast EP368: An Overview of TSMC Open Innovation Platform (OIP) event with Aveek Sarkar

TSMC is embedding agentic AI and system-level co-design across its 90-member OIP ecosystem to address AI's compounding power and packaging demands.

• OIP ecosystem scale: TSMC's Open Innovation Platform spans ~90 members and 100,000+ certified IP titles, covering EDA, IP, cloud, OSAT, substrate and memory partners.
• AI-driven design productivity: TSMC cites 3-5x PPA gains for digital designs and 6x productivity improvement for analog circuit migration using AI-first/agentic design flows via the new 'TSMC AI Design Kit' (ADK).

Themes, sentiment and reasons are AI-written paraphrases, checked so they never quote an episode. They may contain errors. Not investment advice. Episodes remain the property of their creators.