TSMC, ASML, and High NA EUV

TSMC will adopt ASML's High NA EUV in 2030, but its real payoff depends on a costly 12-inch photomask transition finishing by 2033.

• Landmark ASML-TSMC pact: The two firms announced a joint push to move EUV lithography photomasks from the current 6-inch standard to 12-inch, targeting a pilot line by 2031 and 12-inch High NA production by 2033.
• TSMC's own High NA timeline: TSMC plans to use ASML's High NA EUV in high-volume manufacturing for advanced nodes starting in 2030, after years of holding off.

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